Shiga, Japan

Miku Hashimoto

This inventor holds 1 USPTO granted patent, plus 1 CIPO patent. Top assignee: Future Labo Co., Ltd.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Miku Hashimoto. Retrieved from https://idiyas.com/inventor/miku-hashimoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Miku Hashimoto: Innovator in Packaging Technology

Introduction

Miku Hashimoto is a prominent inventor based in Shiga, Japan. She has made significant contributions to the field of packaging technology, particularly with her innovative designs that enhance user experience and functionality.

Latest Patents

Miku Hashimoto holds a patent for a peel-openable package and opening structure for a peel-openable package. This invention includes a lid that features a sheet member positioned to correspond with a container portion of the package main body. The design incorporates a film member bonded to the surface of the sheet member. Cutouts are formed in a peel region defined in a foldable portion of the members, allowing for easy opening. The cutouts run in a thickness direction and are spaced apart by a predetermined interval, ensuring a user-friendly experience.

Career Highlights

Miku Hashimoto is associated with Future Labo Co., Ltd., where she continues to develop innovative packaging solutions. Her work focuses on creating products that are not only functional but also enhance the overall consumer experience.

Conclusion

Miku Hashimoto's contributions to packaging technology exemplify her commitment to innovation and user-centered design. Her patent for a peel-openable package showcases her ability to address practical challenges in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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