Lago Vista, TX, United States of America

Miksa deSorgo

This inventor holds 1 USPTO granted patent. Top assignee: Parker-Hannifin Corporation. Active years: 2010.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Miksa deSorgo: Innovator in Thermal Interface Materials

Introduction

Miksa deSorgo is a notable inventor based in Lago Vista, TX (US). He has made significant contributions to the field of thermal management in electronic components. His innovative approach has led to the development of a unique thermal interface material that enhances the efficiency of heat dissipation in electronic devices.

Latest Patents

Miksa deSorgo holds 1 patent for his invention titled "Conformal thermal interface material for electronic components." This patent describes a thermally-conductive interface designed for effectively cooling heat-generating electronic components. The interface is a self-supporting layer of thermally-conductive material that remains stable at room temperature and becomes conformable at elevated temperatures. This transition allows it to adapt to the surfaces of both the electronic component and the associated thermal dissipation member, such as a heat sink.

Career Highlights

Miksa deSorgo is currently employed at Parker-Hannifin Corporation, where he continues to work on innovative solutions in thermal management. His expertise in developing advanced materials has positioned him as a valuable asset in the engineering community.

Collaborations

Miksa collaborates with various professionals in his field, including his coworker Michael H Bunyan. Their combined efforts contribute to the advancement of technology in thermal interface materials.

Conclusion

Miksa deSorgo's work in developing conformal thermal interface materials represents a significant advancement in the field of electronics. His innovative solutions are paving the way for more efficient thermal management in electronic devices.

Profile summary based on public USPTO records.
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