Company Filing History:
Years Active: 2005-2007
Title: Mikko Ilmari Vuorela: Innovator in Radiation Imaging Technology
Introduction
Mikko Ilmari Vuorela is a notable inventor based in Helsinki, Finland. He has made significant contributions to the field of radiation imaging technology, holding 2 patents that showcase his innovative approach to semiconductor substrates.
Latest Patents
Vuorela's latest patents include advancements in conductive adhesive bonded semiconductor substrates for radiation imaging devices. This invention describes a radiation detector and imaging substrate array that utilizes electrically conductive adhesive to ensure electron charge signaling continuity between the detector and read-out substrates. The technique employs a plurality of electrically conductive bonds that connect pixel contacts to signal contacts, making it particularly effective for detection arrays using Cadmium and Tellurium compositions.
Another significant patent is for a low-temperature, bump-bonded radiation imaging device. This device features a temperature-sensitive semiconductor detector substrate that is bump-bonded to a semiconductor CMOS readout substrate. The use of Tellurium compound materials, such as CdTe and CdZnTe, is crucial in this invention. The bump bonds are formed from a low-temperature, lead-free binary solder alloy, which prevents damage to the sensitive detector substrate during assembly.
Career Highlights
Mikko Ilmari Vuorela is associated with Oy Ajat Limited, where he continues to develop innovative solutions in the field of radiation imaging. His work has been instrumental in enhancing the performance and reliability of imaging devices.
Conclusion
Mikko Ilmari Vuorela's contributions to radiation imaging technology through his patents reflect his commitment to innovation and excellence in the field. His work continues to influence advancements in semiconductor technology and imaging devices.