Oy Ajat Limited

Mikko Ilmari Vuorela

The radiation detector/imaging substrate arrays in an x-ray and gamma-ray radiation energy imaging device are described which use an electrically conductive adhesive to provide electron charge signaling continuity between the detector and read-out substrates of the device. The present device utilizes a plurality of electrically conductive bonds each discretely connecting a pixel contact in the pixel pattern to a signal contact in the signal contact pattern, the bonds being an electrically conductive adhesive. This bonding technique is especially useful in detection/imaging arrays having detector substrates comprising Cadmium and Tellurium compositions. The present invention is practicable with semiconductor detector and read-out substrates with or without 'bumped' electrical contacts. The electrically conductive bonds utilize either isotropically or anisotropically conductive adhesives.

Conductive adhesive bonded semiconductor substrates for radiation imaging devices

An x-ray and gamma-ray radiant energy imaging device is disclosed having a temperature sensitive semiconductor detector substrate bump-bonded to a semiconductor CMOS readout substrate. The temperature sensitive, semiconductor detector substrate utilizes Tellurium compound materials, such as CdTe and CdZnTe. The bump bonds are formed of a low-temperature, lead-free binary solder alloy having a melting point between about 100&#xb0; C. and about 180&#xb0; C. Also described is a process for forming solder bumps utilizing the low-temperature, lead-free binary solder alloy, to prevent damage to temperature sensitive and potentially brittle detector substrate when assembling the imaging device.

Growing community of inventors

Helsinki, Finland

Mikko Ilmari Vuorela