Tokyo, Japan

Mikiyuki Ichiba

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.3

ph-index = 2

Forward Citations = 7(Granted Patents)


Location History:

  • Fukuyama, JP (1999)
  • Tokyo, JP (1994 - 2019)

Company Filing History:


Years Active: 1994-2019

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4 patents (USPTO):Explore Patents

Title: Mikiyuki Ichiba: Innovator in Facility Management and Plating Technologies

Introduction

Mikiyuki Ichiba is a notable inventor based in Tokyo, Japan. He has made significant contributions to the fields of facility management and plating technologies. With a total of 4 patents to his name, Ichiba's work reflects a commitment to innovation and practical solutions.

Latest Patents

Ichiba's latest patents include a facility state analysis device, an analysis method for facility state, a storage medium, and a facility management system. The facility state analysis device is designed to accept input regarding the state and location of outdoor facilities. It calculates the average failure year of these facilities through statistical processing based on the input information and a predetermined section on a map. Additionally, he has developed an additive for an acidic tin-plating bath, which consists of specific ingredients that enhance the plating process.

Career Highlights

Throughout his career, Mikiyuki Ichiba has worked with prominent companies such as NKK Corporation and Learonal Japan Inc. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Ichiba has collaborated with talented individuals in his field, including Hiroki Iwasa and Toyofumi Watanabe. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Mikiyuki Ichiba's contributions to facility management and plating technologies demonstrate his innovative spirit and dedication to improving industry standards. His patents and collaborations reflect a significant impact on the fields he engages with.

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