Tokyo, Japan

Mikiyoshi Namura


 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Mikiyoshi Namura: Innovator in Resin Composition Technology

Introduction

Mikiyoshi Namura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of resin compositions for various applications. His innovative work has led to the creation of a patented technology that enhances the performance of heat-sensitive transfer recording materials.

Latest Patents

Namura holds a patent for a "Resin composition for back-surface layer and heat-sensitive transfer recording material." This invention provides a useful resin composition that improves the heat resistance of the back-surface layer in heat-sensitive transfer recording materials. The technology alleviates damage to thermal heads and enhances durability by suppressing bleeding, even with increased silicone content. The resin composition includes a siloxane-modified urethane- or urea-based resin, a secondary resin, and a cross-linking agent, all carefully formulated to optimize performance.

Career Highlights

Namura is associated with Dainichiseika Color & Chemicals Mfg. Co., Ltd., where he has been instrumental in advancing the company's research and development efforts. His expertise in resin technology has positioned him as a key figure in the industry, contributing to innovative solutions that meet the demands of modern applications.

Collaborations

Throughout his career, Namura has collaborated with notable colleagues, including Takeshi Kawaguchi and Motoaki Umezu. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Mikiyoshi Namura's contributions to resin composition technology exemplify the impact of innovation in materials science. His patented work not only enhances the performance of heat-sensitive transfer recording materials but also showcases the importance of collaboration in driving technological advancements.

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