Resin composition for back-surface layer and heat-sensitive transfer recording material

Abstract

There are provided a useful resin composition for a back-surface layer and a heat-sensitive transfer recording material using the same, wherein under the circumstances where the temperature of thermal heads has been increased, the back-surface layer of the formed heat-sensitive transfer recording material has more excellent heat resistance, damage to a thermal head can be alleviated, and durability is excellent in that bleeding is suppressed even if the silicone content is increased. The present invention provides a resin composition for a back-surface layer to be used for forming a back-surface layer of a heat-sensitive transfer recording material, the resin composition containing, as film-forming components, a siloxane-modified urethane- or urea-based resin A, a resin B, and a cross-linking agent C, wherein the resin A contains a polysiloxane component in a range of 5 to 55%, the resin B has at least one active-hydrogen-containing group and has a glass transition point of lower than 100° C., and when the total amount of the resin A, resin B, and the cross-linking agent C is assumed to be 100%, the resin A is contained within a range of 1 to 79%, the resin B is contained within a range of 1 to 79%, and the cross-linking agent C is contained within a range of 20 to 80%. The present invention also provides a heat-sensitive transfer recording material using the resin composition for a back-surface layer.