Company Filing History:
Years Active: 2013-2014
Title: Miki Hayashi: Innovator in Semiconductor Technology
Introduction
Miki Hayashi is a prominent inventor based in Ibaraki, Japan. She has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. Her innovative work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Miki Hayashi's latest patents include a dicing tape-integrated film for semiconductor back surfaces. This invention provides a dicing tape that includes a base material and a pressure-sensitive adhesive layer, along with a film for flip chip type semiconductor back surfaces. The film is designed to have a storage elastic modulus ranging from 0.9 MPa to 15 MPa at 60°C. Another notable patent is for a die bond film that adheres to semiconductor elements connected by bonding wires. This invention aims to improve manufacturing yield by preventing deformation and cutting of the bonding wire, featuring a unique adhesive layer design.
Career Highlights
Miki Hayashi is currently employed at Nitto Denko Corporation, where she continues to develop innovative solutions in semiconductor technology. Her work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.
Collaborations
Miki collaborates with talented individuals such as Naohide Takamoto and Kenji Oonishi, contributing to a dynamic and innovative work environment.
Conclusion
Miki Hayashi's contributions to semiconductor technology through her patents and collaborative efforts highlight her role as a leading inventor in the field. Her work continues to influence the development of advanced semiconductor solutions.