Heverlee, Belgium

Mikhail Krishtab

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020-2024

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2 patents (USPTO):Explore Patents

Title: Mikhail Krishtab: Innovator in Patterning Technologies

Introduction

Mikhail Krishtab is a notable inventor based in Heverlee, Belgium. He has made significant contributions to the field of patterning technologies, holding two patents that showcase his innovative approaches. His work is characterized by a focus on advanced materials and methods that enhance the efficiency and effectiveness of patterning processes.

Latest Patents

Krishtab's latest patents include a method for forming a resistless patterning mask. This method involves several steps, including providing a first layer over a substrate, bonding a monolayer to the first layer, and selectively depositing an amorphous carbon layer. The process aims to create a precise pattern that can be utilized in various applications. Another significant patent relates to the selective deposition of metal-organic frameworks. This method allows for the formation of a low-k dielectric film selectively on exposed dielectric locations, enhancing the performance of electronic devices.

Career Highlights

Throughout his career, Mikhail Krishtab has worked with esteemed organizations such as Imec Vzw and Katholieke Universiteit Leuven, also known as KU Leuven R&D. His experience in these institutions has allowed him to collaborate on cutting-edge research and development projects, furthering advancements in his field.

Collaborations

Krishtab has collaborated with notable colleagues, including Silvia Armini and Ivo Stassen. These partnerships have contributed to the successful development of his innovative technologies.

Conclusion

Mikhail Krishtab stands out as a prominent inventor in the realm of patterning technologies. His patents reflect a commitment to advancing the field through innovative methods and materials. His contributions continue to influence the landscape of technology and research.

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