Zurich, Switzerland

Mikhail Kliuev

This inventor holds 1 USPTO granted patent, plus 1 CIPO patent and 1 EPO patent. Top assignee: Agie Charmilles Sa. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mikhail Kliuev. Retrieved from https://idiyas.com/inventor/mikhail-kliuev

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Mikhail Kliuev: Innovator in Electrical Machining

Introduction

Mikhail Kliuev is a notable inventor based in Zurich, Switzerland. He has made significant contributions to the field of electrical machining, showcasing his innovative spirit through his patented inventions.

Latest Patents

Kliuev holds a patent for a "Method and device for machining shapes using electrical machining." This invention provides a method for machining shapes such as slots, cavities, or apertures using a plurality of first type holes and second type holes. During the machining of first type holes, the hole circumference completely envelopes the respective portion of the electrode circumference. This innovative approach enhances the precision and efficiency of electrical machining processes.

Career Highlights

Mikhail Kliuev is associated with Agie Charmilles SA, a company known for its advanced manufacturing technologies. His work at the company has allowed him to develop and refine his innovative ideas in electrical machining.

Collaborations

Kliuev collaborates with Umang Maradia, contributing to the advancement of their projects and innovations in the field.

Conclusion

Mikhail Kliuev's contributions to electrical machining through his patent and work at Agie Charmilles SA highlight his role as an innovator in the industry. His dedication to improving machining methods continues to influence the field positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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