Gilbert, AZ, United States of America

Mike T Reiter


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: **Mike T. Reiter: Innovator in Integrated Circuit Packaging**

Introduction

Mike T. Reiter, an accomplished inventor based in Gilbert, AZ, has made significant contributions to the field of integrated circuit packaging. With one patent to his name, Reiter’s innovative approach to heat management in electronics showcases his expertise and creativity. He is currently employed at Intel Corporation, where he collaborates with other talented professionals in advancing technology.

Latest Patents

Reiter holds a patent for a "Package and Method for Attaching an Integrated Heat Spreader." This invention outlines an integrated circuit package that combines a substrate with a heat spreader. The design is further enhanced by thermal interface materials that connect the die to the heat spreader. Notably, the heat spreader is affixed to the substrate using fasteners such as rivets, barbed connectors, and gripping clips, as opposed to traditional sealant-adhesives. This methodology aims to improve thermal management while ensuring a reliable connection between components.

Career Highlights

Throughout his career at Intel Corporation, Mike T. Reiter has been instrumental in pushing the boundaries of integrated circuit design. His ability to combine innovative techniques with practical applications has made a considerable impact in the field. Reiter’s work exemplifies the importance of efficient heat dissipation in electronics, particularly as devices continue to shrink in size and increase in power.

Collaborations

In his role at Intel, Reiter collaborates with esteemed colleagues like Christopher L. Rumer and Sabina J. Houle. Together, they work on groundbreaking projects that aim to enhance electronic device performance and reliability. These partnerships underscore the collaborative nature of innovation at Intel, where teamwork and shared expertise drive technological advances.

Conclusion

Mike T. Reiter stands out as a prominent figure in the field of integrated circuit packaging. His inventive solutions and collaborative spirit contribute to the ongoing success of Intel Corporation. As technology continues to evolve, innovators like Reiter are essential for developing new ideas that can lead to breakthroughs in electronics.

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