Mike P Pierce

Title: Mike P Pierce - Innovator in Semiconductor Technology

Introduction

Mike P Pierce is a notable inventor based in Plano, TX (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent that enhances the efficiency of wire bonding processes in integrated circuits.

Latest Patents

Mike P Pierce holds a patent titled "Bonding alignment mark for bonds over active circuits." This invention involves a semiconductor chip that features an alignment mark, which is particularly useful for wire bonder alignment on chips with bonding surfaces over active circuits. The alignment marks are strategically fabricated on the diagonal corners of the chip, consisting of a pair of touching squares rotated 90 degrees from each other. This unique positioning and rotation provide both gross chip positioning features for mounting on a lead frame and fine alignment aids for wire bonding. The high visual contrast features of the alignment mark are fabricated simultaneously with the top active metallization of the IC chip, ensuring they are not covered by passivation coating or additional metal layers. Mike P Pierce has 1 patent to his name.

Career Highlights

Mike P Pierce is associated with Texas Instruments Corporation, a leading company in the semiconductor industry. His work has contributed to advancements in chip design and manufacturing processes, showcasing his expertise and innovative thinking.

Collaborations

Some of his notable coworkers include Laura A Hnilo and David Alexander Grant, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Mike P Pierce's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the industry. His work continues to influence the efficiency and effectiveness of wire bonding processes in integrated circuits.