Company Filing History:
Years Active: 2003-2005
Title: The Innovations of Mike Lardner
Introduction
Mike Lardner is a notable inventor based in Tuam, Ireland. He has made significant contributions to the field of technology, particularly in the area of system-on-a-chip design. With a total of 3 patents to his name, Lardner's work has had a considerable impact on the industry.
Latest Patents
Lardner's latest patents include innovative solutions that enhance the functionality of interconnect logic components. One of his patents, titled "Automatic generation of interconnect logic components," describes a program tool that automatically generates interconnect logic for a system-on-a-chip. This tool is based on a library of operational cores and an architecture that requires all data exchange between cores to proceed via shared memory, which may be 'off-chip'. The architecture also includes a data aggregation technique for access to memory with successive levels of arbitration. Another significant patent is "ASIC system architecture including data aggregation technique," which outlines an architecture for a system on a chip where functional cores have wrappers for compatibility with a common bus system. This bus system includes aggregators for bus transactions of different speeds and/or bus widths.
Career Highlights
Mike Lardner is currently employed at 3Com Corporation, where he continues to innovate and develop new technologies. His work at the company has allowed him to collaborate with other talented professionals in the field.
Collaborations
Some of Lardner's notable coworkers include Tadhg Creedon and Vincent Gavin. Their collaborative efforts have contributed to the advancement of technology in their respective areas of expertise.
Conclusion
Mike Lardner's contributions to the field of technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of system-on-a-chip design and interconnect logic components.