Burton, OH, United States of America

Mike E Lester

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:

goldMedal2 out of 832,680 
Other
 patents

Years Active: 2003-2004

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2 patents (USPTO):

Title: Mike E Lester: Innovator in Conductive Filler Technology

Introduction

Mike E Lester is an accomplished inventor based in Burton, OH (US). He has made significant contributions to the field of conductive materials, holding a total of 2 patents. His innovative approaches have paved the way for advancements in electrically conductive fillers.

Latest Patents

Mike E Lester's latest patents focus on methods of creating conductive fillers. One of his notable inventions is a method for producing an electrically conductive filler by placing a web of core material onto an interior surface of a web of conductive layer material. This process involves directing the webs through a forming station, where the conductive layer is folded around the core. The resulting filler features a substantially non-conductive core enveloped by a conductive layer, establishing conductivity from the bottom to the top of the filler through paths on each side. Another patent details the electrically conductive filler itself, emphasizing the same core and layer structure that enhances conductivity.

Career Highlights

Throughout his career, Mike E Lester has demonstrated a commitment to innovation in material science. His work has not only contributed to the development of new products but has also influenced industry standards for conductive materials. His patents reflect a deep understanding of the technical requirements for creating effective conductive fillers.

Collaborations

Mike has collaborated with notable colleagues such as Rick L Angell and Franklin T Emery. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise, further enhancing the quality of their innovations.

Conclusion

Mike E Lester stands out as a key figure in the development of conductive filler technology. His patents and collaborative efforts highlight his dedication to advancing the field and improving the functionality of conductive materials.

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