This inventor holds 2 USPTO granted patents. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 2004-2007.
Company Filing History:
Years Active: 2004-2007
Title: Miho Kurihara: Innovator in CMP Abrasive Technologies
Introduction
Miho Kurihara is an accomplished inventor based in Hitachi, Japan, renowned for her contributions to the field of chemical mechanical polishing (CMP) abrasive technologies. With two patents to her name, she is recognized for her commitment to developing innovative solutions that enhance substrate polishing processes.
Latest Patents
Kurihara's latest patents include a CMP abrasive composition and a method for polishing substrates. The CMP abrasive consists of a cerium oxide slurry that contains cerium oxide particles, a dispersant, and water, complemented by a liquid additive featuring a dispersant and water as well. Her innovative method for polishing substrates involves holding a substrate with a film to be polished against a polishing pad, pressing it, and moving both the substrate and polishing platen while supplying the CMP abrasive between the film and polishing pad. This approach allows for effective polishing of surfaces like silicon oxide and silicon nitride films, ensuring no contamination with alkali metals such as sodium ions and maintaining high storage stability of the abrasive.
Career Highlights
Miho Kurihara has made significant strides in her career, working with Hitachi Chemical Company, Ltd., where she continues to advance CMP abrasive technologies. Her expertise in this field has made her a valuable asset to the company, where her innovations contribute to enhanced efficiency and quality in substrate polishing.
Collaborations
Throughout her career, Kurihara has collaborated with notable colleagues, including Toshihiko Akahori and Toranosuke Ashizawa. These partnerships have fostered an environment of creativity and innovation, allowing for the development of new technologies in the abrasive polishing sector.
Conclusion
Miho Kurihara stands out as a leading inventor in CMP abrasive technologies, with her work directly impacting the efficiency and quality of various polishing applications. As she continues to innovate and collaborate, her contributions to the field are poised to lead to even greater advancements in substrate polishing technologies.