This inventor holds 1 USPTO granted patent. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Mickael Pommier: Interposer Manufacturing Innovation
Introduction
Mickael Pommier is an inventor based in Caen, France, associated with Murata Manufacturing Co., Ltd. His patent work concerns a method for manufacturing an interposer product, with a focus on forming and planarizing a bonding bump.
Latest Patents
Pommier is named on 1 patent: “Method of manufacturing an interposer product.” The method forms a wire-bonding pad and a second gold-layer portion on the same side of an interposer substrate. Au—Sn solder is deposited on the second portion and reflowed with it to create a bonding bump, most of which has the eutectic composition of the gold-tin alloy. The solder’s initial composition contains a smaller proportion of gold than the eutectic composition. The bump is then planarized to achieve a selected height and a flat bonding surface.
Career Highlights
The patent describes a manufacturing approach that combines gold-layer formation, solder deposition, reflow, and planarization. These steps are intended to produce a bonding bump with a controlled height and flat surface.
Collaborations
Pommier’s listed coworkers include Sophie Gaborieau and Dominique Yon. His company affiliation is Murata Manufacturing Co., Ltd.
Conclusion
Mickael Pommier’s patent documents a specialized interposer-manufacturing method that uses reflow and planarization to create a controlled, flat Au—Sn bonding bump.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile