This inventor holds 2 USPTO granted patents. Top assignee: Idemia France. Active years: 2018-2019.
Company Filing History:
Years Active: 2018-2019
Title: Innovations by Mickael Huet
Introduction
Mickael Huet is an accomplished inventor based in Colombes, France. He has made significant contributions to the field of technology, particularly in the development of innovative methods and tools for fabricating advanced materials. With a total of two patents to his name, Huet's work showcases his expertise and creativity in addressing complex engineering challenges.
Latest Patents
Mickael Huet's latest patents include a method for fabricating a plate of large thickness that incorporates a detachable card of small thickness. This innovative method involves creating a spotface in the plate, punching in the spotface zone, and pre-cutting an outline of the card to ensure it is detachable. His second patent is for a dual module for a dual chip card, which features a supporting film with connecting pads and inner connection areas for antenna and chip connections. This design enhances the functionality and efficiency of dual chip cards.
Career Highlights
Huet's career is marked by his dedication to advancing technology through innovative solutions. His work at Idemia France has allowed him to collaborate with other talented professionals in the field. His patents reflect his commitment to improving product design and functionality, making significant strides in the industry.
Collaborations
Mickael Huet has worked alongside notable colleagues such as Olivier Bosquet and Philippe Gac. Their collaborative efforts have contributed to the successful development of cutting-edge technologies and solutions.
Conclusion
Mickael Huet's contributions to the field of technology through his patents and collaborative work highlight his role as a leading inventor. His innovative methods and designs continue to influence advancements in the industry.