Idemia France

Mickael Huet

Olivier Bosquet

Philippe Gac

Jean-Michel Fontaine

A method and tooling for fabricating a thin plastic plate of large format and of large thickness and including a card of small format and of small thickness that is detachable from the plate. The method, which may be implemented using the tooling, includes operations for making a spotface in a face of the plate to a depth equal to the difference between the large thickness and the small thickness; punching in the spotface zone along a leveling direction facing another face of the plate opposite from the first face, to a leveling stroke (e) equal to the depth of the spotface, in order to bring the bottom of the spotface level with the first face of the plate; and pre-cutting an outline of the card within the leveled zone, in order to make the card detachable.

Fabricating a plate of large thickness including a detachable card of small thickness

A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.

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Colombes, France

Mickael Huet