This inventor holds 2 USPTO granted patents. Top assignee: Ngk Spark Plug Company, Limited. Active years: 2005-2008.
Company Filing History:
Years Active: 2005-2008
Title: Michitoshi Nakata: Innovator in Wiring Substrate Technology
Introduction
Michitoshi Nakata is a prominent inventor based in Tajimi, Japan. He has made significant contributions to the field of wiring substrate technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of electronic components.
Latest Patents
Nakata's latest patents include a novel wiring substrate design. This wiring substrate features a stacked portion that includes a conductor layer and a resin layer, which is strategically placed on a core substrate. The core substrate contains a substantially cylindrical through hole conductor and a filling material that occupies the hollow portion of the through hole. The design incorporates a cover-shaped conductor portion that covers the end face of the through hole, ensuring connectivity with external devices through a terminal pad conductor. Additionally, he has developed a solder paste printing method and apparatus, which streamlines the manufacturing process of wiring substrates with solder-printed layers.
Career Highlights
Nakata is currently employed at NGK Spark Plug Company, Limited, where he continues to innovate in the field of electronic components. His expertise in wiring substrates has positioned him as a key player in the industry, contributing to advancements that enhance product performance.
Collaborations
One of Nakata's notable collaborators is Hajime Saiki. Together, they have worked on various projects that aim to push the boundaries of technology in their field.
Conclusion
Michitoshi Nakata's contributions to wiring substrate technology exemplify his dedication to innovation. His patents reflect a deep understanding of electronic components and their manufacturing processes. Nakata's work continues to influence the industry, paving the way for future advancements.