Yuki, Japan

Michio Takebe

This inventor holds 1 USPTO granted patent. Top assignee: Fujitsu Corporation. Active years: 1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michio Takebe. Retrieved from https://idiyas.com/inventor/michio-takebe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: Michio Takebe: Innovator in IC Sheet Processing Technology

Introduction

Michio Takebe is a notable inventor based in Yuki, Japan. He has made significant contributions to the field of integrated circuit (IC) processing technology. His innovative work has led to the development of a unique patent that enhances the efficiency of IC sheet processing.

Latest Patents

Takebe holds a patent for an "IC sheet cutting press and IC sheet processing apparatus using the same." This invention performs a series of press cutting operations to separate ICs from an IC sheet while feeding the IC sheet stepwise. The design includes a series of press molds and an IC feed mechanism mounted on a common die set, constituting a single press mold unit. This allows for easy exchange of the press mold unit when different types of IC sheets are to be machined, improving operating efficiency and compatibility.

Career Highlights

Takebe is associated with Fujitsu Corporation, where he has applied his expertise in IC technology. His work has been instrumental in advancing the capabilities of IC sheet processing, making it more efficient and automated.

Collaborations

Some of his notable coworkers include Tatsuo Kimura and Yukio Kato, who have collaborated with him on various projects within the field of IC technology.

Conclusion

Michio Takebe's contributions to IC sheet processing technology exemplify innovation in the field. His patent not only enhances operational efficiency but also sets a standard for future developments in IC processing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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