Bologna, Italy

Michele De Filippis

This inventor holds 1 USPTO granted patent. Top assignee: Datalogic IP Tech S.r.l.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michele De Filippis. Retrieved from https://idiyas.com/inventor/michele-de-filippis

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Michele De Filippis: Innovator in Enclosure Technology

Introduction

Michele De Filippis is a notable inventor based in Bologna, Italy. He has made significant contributions to the field of enclosure technology, particularly with his innovative designs that enhance functionality and efficiency.

Latest Patents

Michele holds a patent for a "Multipurpose Enclosure Boss Assembly." This invention features a first boss that is integrally formed with a first portion of an enclosure, which cooperates with a second portion to enclose a volume. The design includes a first passage that communicates between the enclosed volume and the external environment. Additionally, it incorporates an enclosure screw with an enlarged head and a threaded insert that ensures a tight fit within the assembly.

Career Highlights

Michele De Filippis is currently employed at Datalogic IP Tech S.r.l., where he continues to develop innovative solutions in enclosure technology. His work has been instrumental in advancing the capabilities of enclosure systems.

Collaborations

Michele collaborates with his coworker, Davide Bruni, to further enhance their projects and drive innovation within their field.

Conclusion

Michele De Filippis exemplifies the spirit of innovation through his patent and contributions to enclosure technology. His work at Datalogic IP Tech S.r.l. continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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