Beynes, France

Michel Moreau


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Michel Moreau: A Pioneer in Integrated Circuit Technology

Introduction: Michel Moreau, an inventive spirit based in Beynes, France, has made significant strides in the field of integrated circuit technology. With a focus on enhancing signal transmission at high frequencies, he holds a key patent that exemplifies his contributions to the tech industry. Moreau's work not only highlights his ingenuity but also reflects the collaborative nature of technological advancements.

Latest Patents: Michel Moreau's notable patent is titled "Three-dimensional integrated circuit package having conductors." This innovative design involves a package for integrated circuits that features conductors arranged on multiple levels to create a three-dimensional structure. These conductors are strategically distributed to maintain a constant characteristic impedance, making it ideal for transmitting signals at very high frequencies. The integration of two pairs of conductors operating at fixed potentials, along with a single-pole signal conductor, showcases the complexity and efficiency of Moreau's invention.

Career Highlights: Moreau's career at Bull S.A. has been marked by remarkable achievements in the realm of electronics and signal processing. His work has contributed to advancements in how integrated circuits are designed and manufactured, particularly in applications that demand high performance and reliability.

Collaborations: Throughout his journey, Michel Moreau has had the opportunity to collaborate with esteemed coworkers, notably Gerard Dehaine and Roland Marbot. Together, they have fostered an environment of innovation, pushing the boundaries of circuit design and functionality in the tech landscape.

Conclusion: In conclusion, Michel Moreau's inventive contributions have played a crucial role in the advancement of integrated circuit technology. His singular patent represents a leap forward in high-frequency signal transmission, highlighting his expertise and commitment to innovation. The collaborative efforts with his peers further enrich the legacy he is building in the field.

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