Chaumes en Brie, France

Michel Luc

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Erca. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michel Luc. Retrieved from https://idiyas.com/inventor/michel-luc-8ksfd6tf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Michel Luc - Innovator in Thermoforming Technology

Introduction

Michel Luc is a notable inventor based in Chaumes en Brie, France. He has made significant contributions to the field of manufacturing, particularly in the area of thermoforming technology. His innovative approach has led to the development of a unique device that enhances the production of receptacles with decorative wrap-around labels.

Latest Patents

Michel Luc holds a patent for a "Device and method for manufacturing receptacles provided with decorative wrap-around labels by thermoforming." This device features a mold block with at least one thermoforming chamber, an axial opening for inserting decorative labels, and a moving end-wall that adjusts between different levels. The design includes a tongue-and-groove set that ensures precise engagement during the thermoforming process. He has 1 patent to his name.

Career Highlights

Throughout his career, Michel has worked with Erca, where he has applied his expertise in thermoforming technology. His work has focused on improving manufacturing processes and enhancing product quality through innovative design.

Collaborations

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Conclusion

Michel Luc's contributions to thermoforming technology exemplify the spirit of innovation in manufacturing. His patented device represents a significant advancement in the production of decorative receptacles, showcasing his commitment to enhancing industrial processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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