Michael Zernack

Title: Michael Zernack: Innovator in Laser Dicing Technology

Introduction

Michael Zernack is a notable inventor based in Hamburg, Germany. He has made significant contributions to the field of integrated circuit (IC) device manufacturing. With a total of 2 patents, Zernack's work focuses on innovative methods for enhancing the efficiency and precision of wafer processing.

Latest Patents

Zernack's latest patents include a "Variable Stealth Laser Dicing Process." This invention provides a method for separating IC device die from a wafer, which involves attaching the front side of the wafer to a dicing tape and forming modification zones within cutting lanes. The process allows for the propagation of cracks to separate active devices effectively. Another significant patent is for "Die Preparation for Wafer-Level Chip Scale Package (WLCSP)." This method involves grinding the back side of the wafer substrate to a specific thickness and sawing trenches along device die boundaries, which are then etched to achieve a rounded bevel profile.

Career Highlights

Michael Zernack is currently employed at NXP B.V., a company known for its advancements in semiconductor technology. His work at NXP has allowed him to develop and refine his innovative techniques in laser dicing and wafer processing.

Collaborations

Zernack has collaborated with notable colleagues, including Hartmut Buenning and Sascha Moeller. These partnerships have contributed to the development of his patented technologies and have fostered a collaborative environment for innovation.

Conclusion

Michael Zernack is a prominent figure in the field of semiconductor technology, with a focus on laser dicing processes. His contributions through his patents reflect his commitment to advancing manufacturing techniques in the industry.