Erie, PA, United States of America

Michael Z Wang

This inventor holds 1 USPTO granted patent. Top assignee: Lord Corporation. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Z Wang. Retrieved from https://idiyas.com/inventor/michael-z-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Unveiling the Innovations of Michael Z Wang from Erie, PA

Introduction: Michael Z Wang, an accomplished inventor hailing from Erie, PA, has left a remarkable imprint in the field of composite materials and adhesives with his groundbreaking patent.

Latest Patents: Michael Z Wang's notable patent is the Reinforced Composite and Adhesive. This invention features a composite that incorporates an elastomer of low unsaturation, a coated reinforcing fiber, and an adhesive composition, including a halogenated polyolefin, a nitroso compound, and a maleimide in specific proportions.

Career Highlights: Michael Z Wang is a valuable asset to the renowned Lord Corporation, where he has dedicated his expertise to pioneering advancements in composite materials. With a keen focus on innovation, Wang has successfully obtained one patent that showcases his ingenuity and technical prowess.

Collaborations: Throughout his career, Michael Z Wang has collaborated closely with esteemed colleagues such as James R Halladay and Douglas H Mowrey. Together, they have synergized their skills to push the boundaries of composite technology and adhesive applications.

Conclusion: In conclusion, Michael Z Wang stands as a beacon of innovation in Erie, PA, contributing significantly to the realm of composite materials and adhesives. His patent serves as a testament to his unwavering dedication to technological advancement and his ability to turn inventive ideas into tangible solutions that benefit industries worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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