Michael V Leoni

Title: Michael V Leoni: Innovator in Semiconductor Technology

Introduction

Michael V Leoni is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the functionality of bond pads in integrated circuits.

Latest Patents

Michael holds a patent for a semiconductor device having a bond pad and method therefor. This patent describes a bond pad that includes a first wire bond region and a second wire bond region. In one embodiment, the first wire bond region extends over a passivation layer. In an alternate embodiment, the bond pad features a probe region, a first wire bond region, and a second wire bond region. The design allows for multiple wire connections to a single bond pad, which is particularly beneficial in multi-chip packages. Additionally, the ability for the bond pads to extend over the passivation layer contributes to a reduced integrated circuit die area.

Career Highlights

Michael is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing technologies that improve the efficiency and performance of electronic devices.

Collaborations

Michael has collaborated with several talented individuals in his field, including Susan H Downey and Peter R Harper. These collaborations have fostered an environment of innovation and creativity, leading to advancements in semiconductor technology.

Conclusion

Michael V Leoni is a distinguished inventor whose contributions to semiconductor technology have made a lasting impact. His patent for a semiconductor device showcases his innovative spirit and dedication to improving electronic components. His work continues to influence the industry and inspire future innovations.