Michael Taesch

Title: Michael Taesch - Innovator in Additive Manufacturing

Introduction

Michael Taesch is an accomplished inventor based in Rochester Hills, MI (US). He has made significant contributions to the field of additive manufacturing, showcasing his expertise through innovative patent developments. His work focuses on enhancing the design and manufacturing processes of additive models.

Latest Patents

Michael Taesch holds a patent for an "Additive Swept Wedge Buildup Toolpath." This patent outlines systems and methods for designing and manufacturing an additive manufacturing (AM) model. The method includes computing a wedge plane and initial toolpath for an AM model based on a breaking angle. It also involves trimming an excess toolpath of the AM model using a breaking plane. Furthermore, the method builds the toolpath along the normal of a first layer and trims based on the next layer. The process continues by building a next wedge of the toolpath in the direction of a wedge plane used to trim a previous wedge. Finally, the method includes storing the toolpath. Michael's innovative approach has the potential to streamline additive manufacturing processes.

Career Highlights

Michael Taesch is currently employed at Siemens Industry Software GmbH, where he applies his knowledge and skills to advance the field of additive manufacturing. His work at Siemens has allowed him to collaborate with other talented professionals in the industry.

Collaborations

Michael has worked alongside notable colleagues such as James Maynard and Mai-Anh T Bui. Their combined expertise contributes to the innovative environment at Siemens and enhances the development of cutting-edge technologies.

Conclusion

Michael Taesch is a prominent figure in the realm of additive manufacturing, with a patent that reflects his innovative spirit and technical prowess. His contributions are paving the way for advancements in the industry, and his work continues to inspire future developments.