South Burlington, VT, United States of America

Michael T Coster

This inventor holds 1 USPTO granted patent. Top assignee: Globalfoundries Inc.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael T Coster. Retrieved from https://idiyas.com/inventor/michael-t-coster

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Michael T. Coster and Integrated-Circuit Testing

Introduction

Michael T. Coster is an inventor associated with South Burlington, Vermont, and GlobalFoundries Inc. His patent work addresses methods and structures for testing integrated circuits on a wafer.

Latest Patents

Coster is credited with 1 patent: “Methods for Testing Integrated Circuits of Wafer and Testing Structures for Integrated Circuits.” The invention describes depositing sacrificial material over a conductor on an integrated circuit, contacting that material with a test probe, and testing the circuit through the probe. After testing, the sacrificial material is removed. This approach is intended to protect the underlying conductor during testing.

Career Highlights

Coster’s listed patent connects his work with semiconductor manufacturing and wafer-level integrated-circuit testing. The disclosed method uses a removable layer to facilitate electrical testing while preserving the conductor beneath it.

Collaborations

Coster’s listed coworkers include Mark A. DiRocco and Kirk David Peterson. His company affiliation is GlobalFoundries Inc.

Conclusion

Michael T. Coster’s patent focuses on a practical testing technique that uses removable sacrificial material to help protect integrated-circuit conductors during wafer testing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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