Munich, Austria

Michael Sixt

This inventor holds 3 USPTO granted patents and 2 EPO patents. Top assignees: Max-Planck-Gesellschaft Zur Förderung Der Wissenschaften E. V. , Ist Austria (Institute of Science and Technology Austria). Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Sixt. Retrieved from https://idiyas.com/inventor/michael-sixt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 33.3

 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 4(Granted Patents)


Location History:

  • München, DE (2015)
  • Munich, AT (2016)

Company Filing History:


Years Active: 2015-2026

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3 patents (USPTO):Explore Patents

Title: Michael Sixt - Innovator in Micropatterning Technology

Introduction

Michael Sixt is an accomplished inventor based in Klosterneuburg, Austria. He has made significant contributions to the field of micropatterning, focusing on innovative methods and devices. Although he currently holds no granted patents, his work is noteworthy for its potential impact on various applications.

Latest Patent Applications

Michael Sixt's latest patent application is titled "Micropatterning Assembly, Methods for Micropatterning, and Micropatterned Devices." This invention relates to the field of micropatterning and provides assemblies and methods for micropatterning. The application outlines the development of micropatterned devices obtained through these innovative methods. Furthermore, it describes methods for utilizing these devices effectively.

Conclusion

Michael Sixt's work in micropatterning showcases his dedication to advancing technology in this specialized field. His innovative approaches have the potential to influence future developments in micropatterned devices and applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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