Macungie, PA, United States of America

Michael Sipics


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Michael Sipics - Innovator in Interconnect Technology

Introduction

Michael Sipics is a notable inventor based in Macungie, PA (US). He has made significant contributions to the field of interconnect technology, particularly with his innovative patent related to clamp interconnects. His work has implications for various applications in electronics and connectivity.

Latest Patents

Michael Sipics holds a patent for a device titled "Clamp interconnect." This apparatus includes a bridge member and a clamp. The bridge member is positioned in a first plane and features a substrate with a first surface and a second surface. A plurality of distinct conductive pillars is formed on the second surface of the substrate. The clamp consists of a body, a proximal end, and a distal end. The body is positioned in a second plane above the first plane, with the second plane being within 2 degrees of parallel to the first plane. The proximal end is aligned along the second plane, while the distal end has multiple prongs. The distal end is offset from the second plane toward the bridge member, ensuring that each prong contacts the first surface of the substrate.

Career Highlights

Michael Sipics is currently employed at Infinera Corporation, where he continues to develop innovative solutions in the field of interconnect technology. His work at Infinera has allowed him to collaborate with other talented professionals in the industry.

Collaborations

Some of Michael's coworkers include John Coronati and Eugene Messenger. Their collective expertise contributes to the advancement of technology at Infinera Corporation.

Conclusion

Michael Sipics is a distinguished inventor whose work in clamp interconnect technology showcases his innovative spirit and dedication to advancing electronic connectivity. His contributions are valuable to the industry and highlight the importance of collaboration in technological advancements.

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