Michael Schnorr is a prominent inventor based in Niedernhausen, Germany, known for his innovative contributions to the field of thermal infrared sensing technology. With a portfolio of six patents, Schnorr has significantly advanced the development of sensor arrays that have wide-ranging applications in various industries.

Latest Patents

Among his latest patents is a method for producing a thermal infrared sensor array in a vacuum-filled wafer-level housing. This innovative technique features particularly small dimensions and consists of at least two wafers: a cover wafer and a central wafer that comprises multiple infrared-sensitive sensor pixels positioned over thin slotted membranes. This design is critical for creating efficient sensors that operate in challenging conditions.

Another significant patent involves the production of a high-resolution monolithic silicon micromechanical thermopile array sensor utilizing wafer-level packaging technology. This sensor achieves remarkable spatial resolution with a very high filling degree, all within a compact housing structure. It is manufactured using standard CMOS processes, which makes it economical and accessible for wide-scale production.

Schnorr's high-resolution thermopile infrared sensor array is another notable innovation. It features numerous parallel signal processing channels to manage the signals from a sensor array efficiently. The design aims to minimize power consumption, even in extensive sensor arrays of at least 16 rows and 16 columns. The strategic placement of signal processing channels helps to optimize the performance and efficiency of the sensor chip.

Career Highlights

Michael Schnorr's professional journey includes significant milestones during his tenure at Heimann Sensor GmbH, where he applies his expertise to develop advanced sensor technologies. His work has not only contributed to the success of the company but has also positioned him as a key figure in the evolution of infrared sensing solutions.

Collaborations

Throughout his career, Schnorr has collaborated with talented colleagues, including Jörg Schieferdecker and Bodo Forg. These collaborations have facilitated knowledge exchange and innovation, enabling the team at Heimann Sensor GmbH to push the boundaries of what is possible in the realm of thermal sensors.

Conclusion

Michael Schnorr's innovative work in thermal infrared sensor technology marks him as an essential contributor to this field. His latest patents demonstrate a commitment to advancing sensor design and functionality, while his collaborations with fellow professionals showcase the importance of teamwork in the pursuit of progress. As technology continues to evolve, Schnorr's contributions will undoubtedly play a pivotal role in shaping the future of thermal imaging and sensor applications.

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