Rödelsee, Germany

Michael Schneider

This inventor holds 1 USPTO granted patent. Top assignee: Knauf Gips Kg. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Schneider. Retrieved from https://idiyas.com/inventor/michael-schneider-23tbe1xb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Michael Schneider: Innovator in Acoustic Panel Technology

Introduction

Michael Schneider is a notable inventor based in Rödelsee, Germany. He has made significant contributions to the field of acoustic panel technology. His innovative approach has led to the development of a unique gypsum-based acoustic panel.

Latest Patents

Schneider holds a patent for a gypsum-based acoustic panel. This panel features a core layer of foamed gypsum, with face side and back side layers made of non-woven material encasing the core. The panel is designed to achieve an alpha-value between 0.4 and 0.7, along with specific flow resistances of less than 15000 Pa s/m. The patent also includes methods for the preparation of these panels and their various uses.

Career Highlights

Michael Schneider is associated with Knauf Gips KG, a leading company in the building materials sector. His work at Knauf has allowed him to focus on innovative solutions in acoustic technology. His dedication to research and development has positioned him as a key player in his field.

Collaborations

One of Schneider's notable collaborators is Christian Balling. Their partnership has fostered advancements in the development of acoustic materials.

Conclusion

Michael Schneider's contributions to the field of acoustic panel technology exemplify his innovative spirit and commitment to excellence. His patent for the gypsum-based acoustic panel showcases his ability to blend functionality with advanced materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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