Burlingame, CA, United States of America

Michael Ryan Ng


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 26(Granted Patents)


Company Filing History:


Years Active: 2010-2015

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3 patents (USPTO):Explore Patents

Title: Michael Ryan Ng: Innovator in Solder Technology

Introduction

Michael Ryan Ng is a notable inventor based in Burlingame, CA (US). He has made significant contributions to the field of solder technology, holding a total of 3 patents. His work focuses on improving the efficiency and effectiveness of soldering processes in electronic components.

Latest Patents

One of Michael's latest patents is a method of reducing solder wicking on a substrate. This invention relates to a substrate with via and pad structures designed to minimize solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder masks surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to enhance solder formation, while the solder mask reduces solder formation at the terminal end of the component. This innovative via and pad structure is suitable for a variety of components and high component density. Additionally, the invention provides a computer-implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

Career Highlights

Throughout his career, Michael has worked with prominent companies such as Cisco Technology, Inc. and Flextronics Ap, LLC. His experience in these organizations has allowed him to refine his skills and contribute to various projects in the electronics industry.

Collaborations

Michael has collaborated with several talented individuals, including Glen C Shepherd and Anthony Aaron Lynn Burton. These partnerships have further enriched his work and innovation in the field.

Conclusion

Michael Ryan Ng is a distinguished inventor whose work in solder technology has made a significant impact on the electronics industry. His innovative patents and collaborations highlight his commitment to advancing technology in this field.

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