Company Filing History:
Years Active: 2016
Title: Innovations of Michael Robert Pierce in Power Conversion Technology
Introduction
Michael Robert Pierce is an accomplished inventor based in Bothell, WA (US). He has made significant contributions to the field of power conversion technology, particularly through his innovative designs that enhance the efficiency and performance of electronic components.
Latest Patents
Michael holds a patent for "Transformer-based power converters with 3D printed microchannel heat sink." This invention focuses on systems and methods that allow for weight and size reduction of electronic components, such as transformer rectifier units (TRUs) or autotransformer rectifier units (ATRUs). The patent describes a fluid cooling system that provides high heat dissipation for transformer assemblies by creating a thermal interface at the windings, which are the hottest spots in such assemblies. The cooling system includes a fluid-cooled winding heat sink element, which may be a thermally conductive bar with microchannels positioned between the core and windings of a transformer. Fluid passes through these microchannels to directly cool the heat-generating windings, and the heat sink element can be produced using additive manufacturing technology. Michael's innovative approach addresses critical challenges in thermal management for power converters.
Career Highlights
Michael Robert Pierce is currently employed at Crane Electronics, Inc., where he continues to develop cutting-edge technologies in power conversion. His work has been instrumental in advancing the efficiency and reliability of electronic systems.
Collaborations
Michael has collaborated with notable colleagues, including Ernest Clyde Parker and Fan Wang, who have contributed to his projects and innovations in the field.
Conclusion
Michael Robert Pierce's contributions to power conversion technology exemplify the impact of innovative thinking in engineering. His patent for transformer-based power converters showcases his commitment to enhancing electronic component performance through advanced cooling solutions.