Michael Real is a prominent inventor based in Morgan Hill, CA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative designs and solutions have advanced the capabilities of semiconductor packages, making them more efficient and effective.

Latest Patents

One of Michael's latest patents is for a hybrid semiconductor package. This design includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor, and a first terminal. The package features copper or aluminum bonding wires connecting the first terminal to the output of the RF semiconductor die, along with gold bonding wires designed to handle greater RF Joule heating during operation. Corresponding methods of manufacturing are also described in this patent.

Another notable patent is for a flange for semiconductor die. This semiconductor package consists of a curved body with a plurality of semiconductor die. The design includes first and second opposing end regions and an intermediate center region, with specific curvatures at various inflection points. This innovative structure allows for efficient attachment of semiconductor die, enhancing the overall performance of the package.

Career Highlights

Michael Real is currently employed at Infineon Technologies AG, where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in developing advanced semiconductor solutions that meet the demands of modern technology.

Collaborations

Michael has collaborated with notable coworkers, including Alexander Komposch and Anwar Mohammed. Their combined expertise has contributed to the successful development of innovative semiconductor technologies.

Conclusion

Michael Real is a key figure in the semiconductor industry, with a focus on creating advanced packaging solutions. His patents reflect his commitment to innovation and excellence in technology.