Michael R Schmidt

Title: Michael R Schmidt: Innovator in Extreme Ultraviolet Lithography

Introduction

Michael R Schmidt is a notable inventor based in Milton, Vermont, who has made significant contributions to the field of extreme ultraviolet lithography (EUVL). His innovative work has led to the development of advanced mask structures that are crucial for modern semiconductor manufacturing.

Latest Patents

One of Schmidt's key patents is titled "EUVL mask structure and method of formation." This patent describes a unique mask structure that includes a first conductive layer situated between a buffer layer and an absorber layer. The multilayer stack is designed to reflect EUV radiation effectively, while the absorber layer is engineered to absorb nearly all incident EUV radiation. The patent also details a process for forming a mask pattern in the absorber layer, which includes a method for repairing defects that may occur during the pattern formation.

Career Highlights

Michael R Schmidt is currently employed at International Business Machines Corporation (IBM), where he continues to push the boundaries of technology in the semiconductor industry. His work has been instrumental in enhancing the capabilities of EUVL, which is essential for producing smaller and more efficient electronic components.

Collaborations

Throughout his career, Schmidt has collaborated with talented individuals such as Emily E Fisch and Louis M Kindt. These collaborations have fostered an environment of innovation and have contributed to the advancement of EUVL technologies.

Conclusion

Michael R Schmidt's contributions to extreme ultraviolet lithography exemplify the spirit of innovation in the technology sector. His work not only advances the field but also sets the stage for future developments in semiconductor manufacturing.