Butler, PA, United States of America

Michael R Rykaczewski

This inventor holds 1 USPTO granted patent. Top assignee: Ibis Tek, LLC. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael R Rykaczewski. Retrieved from https://idiyas.com/inventor/michael-r-rykaczewski

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Michael R Rykaczewski: Innovator in Street Sign Technology

Introduction

Michael R Rykaczewski is an accomplished inventor based in Butler, PA (US). He has made significant contributions to the field of street sign technology, showcasing his innovative spirit and technical expertise. His work has led to the development of a unique patent that enhances the functionality and design of street signs.

Latest Patents

Rykaczewski holds a patent for a street sign extrusion. This invention features a flat elongated section where the name of a street can be inscribed or indicated. Additionally, it includes a length of thickened section along the top or bottom edge of the flat section, along with a channel or slot along at least a portion of the thickened section. This design improves the visibility and durability of street signs, making them more effective for public use. He has 1 patent to his name.

Career Highlights

Throughout his career, Rykaczewski has worked with Ibis Tek, LLC, where he has applied his innovative ideas to practical solutions in the field of signage. His dedication to improving street sign technology reflects his commitment to enhancing public safety and communication.

Collaborations

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Conclusion

Michael R Rykaczewski's contributions to street sign technology exemplify the impact of innovation in everyday life. His patent for street sign extrusion demonstrates his ability to combine creativity with functionality, ultimately benefiting communities.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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