This inventor holds 1 USPTO granted patent. Top assignee: Hewlett-Packard Company. Active years: 1994.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1994
Title: Michael Moser: Printed Circuit Board Manufacturing Innovation.
Introduction
Michael Moser is an inventor associated with Stuttgart, Germany, and Hewlett-Packard Company. His patent work addresses a method for manufacturing printed circuit boards with finely patterned conductive structures.
Latest Patents
Moser is credited with 1 patent: “Method of Manufacturing Printing Circuit Boards.” The invention describes forming conductive traces on a metal-foil-laminated insulating carrier board, deactivating the board to remove unwanted deposited substances, and then using electroless chemical metal deposition to build the final conductive structures. In a preferred embodiment, hydrochloric acid is used during deactivation. The method can be applied to single-layer or multilayer boards, with or without through-holes, and supports conductor structures of 50 micrometers or less.
Career Highlights
Moser’s listed patent reflects work on printed circuit board fabrication, particularly the production of precise conductive patterns while retaining portions of the original laminated metal foil as the conductors’ base layer. The available information associates him with Hewlett-Packard Company.
Collaborations
Werner Motz and Albert Ott are identified as Moser’s coworkers. The provided information does not specify their roles in the patent or the invention.
Conclusion
Michael Moser’s patent describes a printed circuit board manufacturing process designed to produce fine conductive structures through patterned traces and electroless metal deposition.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile