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For the Inventor, By the Inventor

Taoyuan, Taiwan

Michael Lin

This inventor holds 16 USPTO granted patents. Top assignees: Waffer Technology Corp., Waffer Tech. Co., Other. Active years: 1998-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Lin. Retrieved from https://idiyas.com/inventor/michael-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16

% Patents Active = 25.0

Average Co-Inventor Count = 2.1

ph-index = 11

Forward Citations = 323(Granted Patents)


Location History:

  • Hsin Chuang, TW (2000)
  • Chong San Chu, Taipei, TW (2000 - 2004)
  • Hsinchuang, Taipei Hsien, TW (2004)
  • Taoyuan, TW (1998 - 2007)

Company Filing History:

goldMedal4 out of 5 
 
Waffer Technology Corp.
 patents
silverMedal1 out of 1 
 
Waffer Tech. Co.
 patent
bronzeMedal15 out of 834,453 
Other
 patents
where one patent can have more than one assignee

Years Active: 1998-2007

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16 patents (USPTO):Explore Patents
1. 7190576 - Internally disposed cooling device for electronic apparatus (2007-03-13),
2. 7069737 - Water-cooling heat dissipation system (2006-07-04),
3. 7019979 - Heat dissipating device having improved fastening structure (2006-03-28),
4. 6968889 - Fastening structure of heat sink (2005-11-29),
5. 6882534 - Fastening device for heat slug (2005-04-19),
6. 6811518 - Treadmill having a powered folding device (2004-11-02),
7. 6716042 - Track system of projector lamp and electrical connection device assembly thereof (2004-04-06),
8. 6672379 - Positioning and buckling structure for use in a radiator (2004-01-06),
9. 6607028 - Positioning structure for heat dissipating fins (2003-08-19),
10. 6595275 - Heat sink assembly (2003-07-22),
11. 6571862 - Heat dissipating fin (2003-06-03),
12. 6542370 - Heat dissipating device for a CPU (2003-04-01),
13. 6116758 - light inlay for various halogen light bulbs, lagging illumination and (2000-09-12),
14. 6077200 - Treadmill having a folding mechanism (2000-06-20),
15. 5800315 - Oval track exercising climber (1998-09-01),

Title: Michael Lin - Innovator in Cooling Technologies

Introduction

Michael Lin is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronic cooling technologies, holding a total of 16 patents. His innovative designs focus on enhancing the efficiency of cooling systems for electronic devices.

Latest Patents

Among his latest patents is an "Internally Disposed Cooling Device for Electronic Apparatus." This device features a cooling member that includes a first cooling unit, a second unit, and a cryogenic element. The cryogenic element has a cold surface that contacts the first cooling unit, producing cold and dry air to cool electronic apparatus effectively. Additionally, the second cooling unit dissipates heat generated from the cryogenic element. Another notable patent is the "Water-Cooling Heat Dissipation System." This system comprises a heat sink mounted on a heat-generating electronic device and a circulating loop connected to the heat sink. The system enhances heat dissipation efficiency by utilizing a cryogenic chip to provide icy water to the heat sink.

Career Highlights

Michael Lin has worked with various companies, including Waffer Technology Corp. His experience in the industry has allowed him to develop cutting-edge technologies that address the challenges of heat management in electronic devices.

Collaborations

Throughout his career, Michael has collaborated with notable individuals such as Jack Wang and Charles Ma. These partnerships have contributed to the advancement of his innovative projects.

Conclusion

Michael Lin's work in cooling technologies has positioned him as a key figure in the field of electronic innovation. His patents reflect a commitment to improving the efficiency and performance of electronic devices through advanced cooling solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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