Company Filing History:
Years Active: 1977
Title: Michael L Matson: Innovator in Semiconductor Packaging
Introduction
Michael L Matson is a notable inventor based in Phoenix, AZ (US). He has made significant contributions to the field of semiconductor technology, particularly in packaging configurations that enhance performance and efficiency.
Latest Patents
Matson holds a patent for a high frequency, high power semiconductor package. This innovative packaging configuration features a heat sink bonded to a semiconductor chip or die, along with a conductor bonded to the die and a metalized ceramic insulating body. This design achieves optimum heat transfer and improves power handling capabilities of semiconductor chips operating at elevated temperatures and gigahertz frequencies. The inclusion of a low pass matching filter further enhances electrical matching and reduces parasitic elements.
Career Highlights
Throughout his career, Matson has been associated with Motorola Corporation, where he has applied his expertise in semiconductor technology. His work has led to advancements that benefit various applications in electronics and telecommunications.
Collaborations
Matson has collaborated with esteemed colleagues such as Hugh Robert Malone and Bernhard A Ziegner, contributing to the development of innovative solutions in semiconductor packaging.
Conclusion
Michael L Matson's contributions to semiconductor packaging technology demonstrate his commitment to innovation and excellence in the field. His patent reflects a significant advancement that enhances the performance of semiconductor devices.