The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 1977
Filed:
May. 17, 1976
Hugh R Malone, Phoenix, AZ (US);
Michael L Matson, Phoenix, AZ (US);
Bernhard A Ziegner, Gilbert, AZ (US);
Motorola, Inc., Chicago, IL (US);
Abstract
A semiconductor packaging configuration is described in which a heat sink is bonded to a semiconductor chip or die and a conductor is bonded to the die and a metalized ceramic insulating body for achieving optimum heat transfer. Additionally, electrical matching and/or reduction of parasitic elements is achieved by a low pass matching filter comprising the capacitance of the chip or die, the capacitance of the metalized ceramic body and the inductance of the electrical conductor. This provides a significant improvement in power handling capabilities of a semiconductor chip or die operating at elevated temperatures and gigahertz frequencies. The electrical conductor geometry and its bonds provide a reduction of the thermal resistance of the package and also provides the inductance which forms part of the low pass matching filter.