Michael L Cooper

Title: Michael L Cooper: Innovator in High-Bandwidth Communication Technologies

Introduction

Michael L Cooper is a notable inventor based in San Diego, California. He has made significant contributions to the field of communication technologies, particularly through his innovative patent related to chip packaging. His work is instrumental in enhancing the performance of computer systems.

Latest Patents

One of Michael L Cooper's key patents is the "Micro-link high-bandwidth chip-to-chip bus." This patent describes a chip package that includes a micro-link between components disposed on a substrate. The micro-link is characterized as an ultra-short multi-conductor transmission line with shared reference planes, resulting in a distribution of impedance values. The composite signal traces in the transmission line can support the communication of one symbol at a time, ensuring that multiple reflections reach a substantial fraction of a steady-state value within a symbol time. This innovation facilitates the continued scaling of communication bandwidth between components with low latency, thereby increasing the performance of computer systems that utilize the chip package.

Career Highlights

Michael L Cooper is currently employed at Oracle International Corporation, where he continues to develop cutting-edge technologies. His work at Oracle has positioned him as a key player in the advancement of high-bandwidth communication solutions.

Collaborations

Throughout his career, Michael has collaborated with talented individuals such as Robert Paul Masleid and Sreemala Pannala. These collaborations have contributed to the successful development of innovative technologies in the field.

Conclusion

Michael L Cooper's contributions to high-bandwidth communication technologies through his patent and work at Oracle International Corporation highlight his role as a significant inventor in the tech industry. His innovations continue to impact the performance of computer systems positively.