Sunnyvale, CA, United States of America

Michael Koken


Average Co-Inventor Count = 3.6

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2006-2008

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3 patents (USPTO):Explore Patents

Title: Innovations by Michael Koken in Heatsink Attachment Technology

Introduction

Michael Koken is an accomplished inventor based in Sunnyvale, California. He has made significant contributions to the field of electronics through his innovative designs and patents. With a total of three patents to his name, Koken has focused on improving the efficiency and effectiveness of heatsink attachment methods in circuit boards.

Latest Patents

Koken's latest patents revolve around techniques for attaching a heatsink to a circuit board using anchors that install from the underside of the circuit board. One of his notable inventions includes a heatsink attachment assembly that features a first anchor and a second anchor, both designed to insert into holes in the circuit board from below. The heatsink clip in this assembly fastens to both anchors, providing downward force on the heatsink, which is crucial for optimal thermal management. Another patent enhances this design by incorporating looped end portions on the anchors, ensuring a robust interference fit with the circuit board and improving overall strength and stability.

Career Highlights

Michael Koken is currently employed at Cisco Technology, Inc., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the design and functionality of electronic components, particularly in the realm of heatsink attachment.

Collaborations

Koken has collaborated with talented coworkers such as Hong Huynh and George Sya, contributing to a dynamic and innovative work environment at Cisco.

Conclusion

Michael Koken's contributions to heatsink attachment technology demonstrate his commitment to innovation in the electronics field. His patents reflect a deep understanding of engineering principles and a drive to enhance product performance.

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