Dallas, TX, United States of America

Michael Kenneth Conti

This inventor holds 2 USPTO granted patents. Top assignee: Octavo Systems LLC. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Kenneth Conti. Retrieved from https://idiyas.com/inventor/michael-kenneth-conti

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: Michael Kenneth Conti: Innovator in System in a Package Technology

Introduction

Michael Kenneth Conti is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of electronics, particularly in the area of System in a Package (SiP) technology. With a total of 2 patents to his name, Conti has demonstrated his expertise and innovative spirit in the industry.

Latest Patents

Conti's latest patents focus on methods and structures for manufacturing one or more System in a Package (SiP) devices. These patents detail how the functionality of a packaged SiP device may be modified by additional components. This innovation is crucial for enhancing the versatility and performance of electronic devices.

Career Highlights

Throughout his career, Michael Kenneth Conti has been associated with Octavo Systems LLC, where he has played a pivotal role in advancing SiP technology. His work has contributed to the development of more efficient and compact electronic solutions.

Collaborations

Conti has collaborated with talented individuals such as Christopher Lloyd Reinert and Masood Murtuza. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Michael Kenneth Conti's contributions to the field of System in a Package technology highlight his role as a leading inventor. His patents and collaborations reflect his commitment to advancing electronic solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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