Chippewa Falls, WI, United States of America

Michael J Tobkin


Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 1995-1996

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2 patents (USPTO):Explore Patents

Title: Michael J Tobkin: Innovator in PCB Tooling Technology

Introduction

Michael J Tobkin is a notable inventor based in Chippewa Falls, WI (US). He has made significant contributions to the field of printed circuit board (PCB) technology. With a total of 2 patents, Tobkin's work focuses on enhancing the manufacturing processes of PCBs, particularly in multi-layer applications.

Latest Patents

Tobkin's latest patents include a PCB tooling apparatus designed for forming patterns on both sides of a substrate. This innovative apparatus provides accurately aligned printed circuits on both major sides of a printed circuit board layer. It is especially advantageous for use in multi-layer PCBs. The invention also discloses the method of manufacturing the apparatus and the methods of using it. The apparatus features patterns formed on glass masks attached to frames that incorporate alignment pins and slots. These patterns include registration marks for alignment during the manufacturing process. During use, the apparatus allows for precise alignment of patterns on both sides of a PCB layer. Additionally, the apparatus includes buttons used to pattern PCB layers that have pre-drilled Z-axis holes.

Career Highlights

Michael J Tobkin is associated with Cray Research, Inc., where he has contributed to advancements in PCB technology. His work has been instrumental in improving the efficiency and accuracy of PCB manufacturing processes.

Collaborations

Tobkin has collaborated with his coworker, Paul E Schroeder, to further enhance the innovations in PCB tooling technology.

Conclusion

Michael J Tobkin's contributions to PCB technology through his patents and work at Cray Research, Inc. highlight his role as an innovator in the field. His inventions continue to influence the manufacturing processes of printed circuit boards, ensuring greater accuracy and efficiency.

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