Melbourne, Australia

Michael J Delaney

This inventor holds 1 USPTO granted patent. Top assignees: Commonwealth Scientific and Industrial Research Organisation, Huntsman Chemical Company Australia Limited. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael J Delaney. Retrieved from https://idiyas.com/inventor/michael-j-delaney-83n4cmfa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Michael J Delaney: Innovator in Wood Adhesives

Introduction

Michael J Delaney is an accomplished inventor based in Melbourne, Australia. He is known for his significant contributions to the field of wood adhesives. With a focus on creating effective bonding solutions, Delaney has developed innovative products that enhance the performance of wood in various applications.

Latest Patents

Delaney holds 1 patent for an adhesive composition. His patent involves a wood adhesive that includes an effective amount of a phenol-formaldehyde resin and a modifying agent. This unique composition allows for strong bonding to hard woods, making it a valuable resource in the woodworking industry.

Career Highlights

Throughout his career, Delaney has worked with notable companies, including Huntsman Chemical Company Australia Limited and the Commonwealth Scientific and Industrial Research Organisation. His experience in these organizations has contributed to his expertise in adhesive technologies and materials science.

Collaborations

Delaney has collaborated with several professionals in his field, including Peter J Collins and Yoshikazu Yazaki. These partnerships have fostered innovation and the exchange of ideas, further advancing the development of adhesive solutions.

Conclusion

Michael J Delaney's work in wood adhesives exemplifies the impact of innovation in material science. His contributions continue to influence the industry and provide effective solutions for wood bonding applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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