Kokomo, IN, United States of America

Michael Ik-Ming Chia

This inventor holds 2 USPTO granted patents. Top assignee: Delco Electronics Corporation. Active years: 1997-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Ik-Ming Chia. Retrieved from https://idiyas.com/inventor/michael-ik-ming-chia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 41(Granted Patents)


Company Filing History:


Years Active: 1997-1999

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2 patents (USPTO):Explore Patents

Title: Michael Ik-Ming Chia: Automotive Sensor Invention

Introduction

Michael Ik-Ming Chia is an inventor associated with Kokomo, Indiana, and Delco Electronics Corporation. His patent work includes technology for detecting failures in vibrating sensors used in automotive controls. He is credited with 2 patents.

Latest Patents

Chia’s listed patent, “Method and Apparatus for Detecting Failure in Vibrating Sensors,” describes a yaw sensor with a vibrating microstructure ring and a driving circuit that maintains vibration at the ring’s resonant frequency. The system detects potential vibration failure by comparing either a compensation signal or the sensed vibration amplitude against a threshold. When a failure is detected, the sensor’s yaw output is replaced with ground potential.

Career Highlights

Chia’s work addresses sensor reliability in automotive control systems. The described method provides a way to identify when a vibrating sensor is no longer operating as intended and to respond with a defined output.

Collaborations

Chia’s listed coworkers include Carl David Wright and Jack Daniel Johnson. His company affiliation is Delco Electronics Corporation.

Conclusion

Michael Ik-Ming Chia’s patent work focuses on detecting failures in vibrating automotive sensors, supporting more reliable operation of vehicle control systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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