Michael Hoenle

Title: Michael Hoenle: Innovator in Component Connection Technology

Introduction

Michael Hoenle is a notable inventor based in Parsberg, Germany. He has made significant contributions to the field of component connection technology, particularly through his innovative methods for producing connections between component parts. His work is characterized by a focus on enhancing the mechanical and electrical bonding processes in electronic components.

Latest Patents

Michael Hoenle holds a patent for a method that involves providing a first component part with a partially exposed first insulating layer, a plurality of first through-vias, and an exposed first contact layer. This method ensures that the first through-vias are laterally enclosed by the first insulating layer, while the first contact layer partially covers the first insulating layer and completely covers the first through-vias. Additionally, the second component part is designed similarly, allowing for a direct bonding process that connects the component parts through overlapping contact layers. This innovative approach enhances the reliability and efficiency of electronic connections.

Career Highlights

Michael Hoenle is currently employed at Osram Opto Semiconductors GmbH, where he continues to develop and refine his innovative technologies. His work at Osram has positioned him as a key player in the advancement of semiconductor technologies, contributing to the company's reputation for excellence in the field.

Collaborations

Michael has collaborated with talented coworkers such as Simeon Katz and Sophia Huppmann. Their combined expertise fosters a creative environment that drives innovation and leads to the development of cutting-edge technologies.

Conclusion

Michael Hoenle's contributions to the field of component connection technology exemplify the spirit of innovation. His patented methods and collaborative efforts at Osram Opto Semiconductors GmbH highlight his commitment to advancing technology in the semiconductor industry.