Corvallis, OR, United States of America

Michael H Hayes

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael H Hayes. Retrieved from https://idiyas.com/inventor/michael-h-hayes-eip0ndni

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: Michael H Hayes: Innovator in Fluid Ejection Technology

Introduction

Michael H Hayes is a notable inventor based in Corvallis, OR (US). He has made significant contributions to the field of fluid ejection technology. His innovative work has led to the development of a patent that showcases his expertise and creativity.

Latest Patents

Michael H Hayes holds a patent for a fluid ejection structure. This structure includes thermal resistors, a substrate, and layers on the substrate. Notably, the layers can include a region proximate to the resistor that has reduced field oxide. This invention demonstrates his ability to enhance fluid ejection mechanisms.

Career Highlights

Michael is currently employed at Hewlett-Packard Development Company, L.P. His role at this esteemed company allows him to further his research and development in innovative technologies. His work has been instrumental in advancing the capabilities of fluid ejection systems.

Collaborations

Michael has collaborated with talented individuals such as Bradley D Chung and Galen P Cook. These partnerships have contributed to the success of his projects and the advancement of technology in their field.

Conclusion

Michael H Hayes is a distinguished inventor whose work in fluid ejection technology has made a significant impact. His patent and collaborations reflect his dedication to innovation and excellence in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…