House Springs, MO, United States of America

Michael G Brown

This inventor holds 1 USPTO granted patent. Top assignee: The Boeing Company. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael G Brown. Retrieved from https://idiyas.com/inventor/michael-g-brown-9ohgzuxg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Michael G. Brown and His Vacuum Support System

Introduction

Michael G. Brown is an inventor based in House Springs, Missouri. His patent work includes a vacuum-based system designed to hold workpieces securely during manufacturing or other work processes. Brown is associated with The Boeing Company.

Latest Patents

Brown is named on one patent, 1 patent: “Vacuum Support System and Apparatus.” The invention describes a vacuum source and support apparatus that use negative pressure to hold one or more workpieces in place. The apparatus has a base frame with a recessed region connected to the vacuum source, support members within that region, and a cover with a gripping surface. When negative pressure is applied, the surface anchors the workpieces.

Career Highlights

Brown’s patent reflects an engineering approach to workpiece support, using vacuum pressure to help maintain stable positioning. The disclosed system combines a frame, support members, and a gripping cover into an apparatus intended to accommodate one or more workpieces.

Collaborations

Brown’s listed coworker is Kevin Thomas Ostrega. The available information identifies both inventors in connection with the patent but does not specify their individual contributions.

Conclusion

Michael G. Brown’s “Vacuum Support System and Apparatus” presents a practical vacuum-based method for supporting workpieces, and represents his documented patent contribution.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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